Autocatalytic silver is an alternative to conventional electroplating and immersion processes. The technology enables silver plating on high complex geometries with narrow tolerances, resulting in high quality performance. Hence, autocatalytic silver has the potential to both improve performance and reduce plating costs. The autocatalytic nature of the processes means that plating is continued as long as the substrate is in the plating bath, without applying a current. This differs from immersion processes, that only plates to a few tenths of a micron and from electroplating, that needs electrodes and an applied current, for plating.
There are many applications foreseen, within
space, telecom and electronics, for the autocatalytic silver technology. For example: Autocatalytic silver plating of 3D-printed
aluminum microwave components. Autocatalytic silver plating of microwave filters and antennas. Plating of ASIG, (Autocatalytic Silver Immersion Gold), as final finish for PCB's.
Space applications of ASIG for PCB's and autocatalytic silver on microwave components have been evaluated for ESA, (European Space Agency),
by the swedish research institute RISE IVF. ASIG finish provided good solderability even after having been exposed to two soldering processes
and autocatalytic silver-plated microwave components meet both RF- and space environment requirements.
ASIG plated PCB
ASIG plated PCB
ASIG plated PCB
5 micron autocatalytic silver plated 3D-printed aluminium waveguide
Autocatalytic silver microstructure: 1000 times magnification
5 micron autocatalytic silver-plated, dip brazed aluminium waveguide
ESM 100: Autocatalytic silver for plating of ASIG, (Autocatalytic Silver Immersion Gold) as final finish for PCB´s.
ESM 100 is licensed to and distributed by Technic Inc, (www.technic.com).
ESM 200: Autocatalytic silver for plating microwave components such as wave guides, filters, and antennas.
NIAG-Activator: Activator used onto electroless nickel plated surfaces followed by ESM 200.
AG-Barrier: Used as a first step on copper followed by ESM 200.
Our processes are easy to set-up and handle. All bath components, except for the key-additives for each process, are based on the components for the ESM 100 process, which are supplied by Technic Inc. The key-additives, which are non-dangerous goods for transportation, will be supplied by us. Click on the additive labels below and read about each process.
ESM 100 is an autocatalytic silver process, designed to be used in conjunction with immersion gold, in the ASIG process,
(Autocatalytic Silver Immersion Gold).
The ASIG process gives excellent gold wire bonding and solder capability.
The ASIG process has been developed as a replacement for nickel based surface finishes which are
known to suffer from quality issues, such as brittle intermetallics or black pad failures.
ESM 100 is a multipurpose final finish for Printed Circuit Boards, (PCB's) and for chip packaging substrates.
Evaluation performed for ESA, showed that the ASIG finish provided surfaces with good solderability even after having been exposed to two soldering
processes. Solder joints formed to various types of components had good reliability.
ESM 200 is an autocatalytic silver process, designed to replace electrolytical silver processes and to give a
conformal coating of silver with excellent electrical conductivity.
The ESM 200 process has been evaluated for ESA, in order to offer a solution to plate complex
geometries for microwave components, in space applications.
Aluminium components plated with electroless nickel + 5 micron silver with ESM 200,
meets both RF- and space environment requirements.
Components made of machined aluminium as well as 3D-printed aluminium, were plated with
electroless nickel + ESM 200 and successfully evaluated.
Further, ESM 200 can be applied onto different surfaces such as, gold, copper, copper alloys and nickel.
Fresh deposited electroless nickel, is activated in NIAG-Activator before ESM 200 is applied.
Copper or copper alloys are deoxidated and immersed in Ag-Barrier, before ESM 200 is applied.
We offer License Agreements for the processes: ESM 200 / NIAG-Activator / Ag-Barrier.
We will make a quotation for supply of documentation and key-additives for initial trials.
This will enable for the customer, to set up the processes in house and perform evaluation.
After test completion and if contented, license agreement can be arranged.
Please contact us and describe your interest/application and we will send technical data sheets
regarding the processes mentioned above, by e-mail.
We are happy to collaborate with you!
Our technology for autocatalytic silver has been developed by Anders Remgård, founder and CEO of
Autocatsilver AB. Anders has a MSc in Chemical Engineering and has been active as an
innovator and entrepreneur within the field of silver-plating since early 90s.
Emma and
Marcus are members of our Advisory Board and have both experience in process development, testing
and documentation of our processes.
Anders, CEO, MSc Chemical Enginnering
Emma, MSc Mechanical Engineering
Marcus, MSc Engineering Physics, BSc Business Administration
